Soldering BGA chips

Here in our company we have a guy who solder BGA chips frequently. First here remove all excess of sold from the board, then he place thermical tape around the component to protect components near it. Then he place pasty flux on the board, place the component over it and use the “Steinel Type 3483 Programmable Heat Gun” to heat and melt the solder.

For lead free solder he uses 490C and to solder with lead he uses 350C.

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s